Director, Flexible Hybrid Medical Device Manufacturing (FlexMed) at Binghamton University
Mark Poliks is an expert in electronics packaging, flexible electronics, materials, processing, roll-to-roll manufacturing, in-line quality control and reliability. He has authored numerous technical papers and invited presentations. He holds over forty U.S. patents. He is a member of the Flex-Tech Alliance technical council, an Associate Editor of the “Journal of Electronic Packaging,” a member of the American Chemical Society, the Materials Research Society and the IEEE/CPMT. Poliks has held senior technical management positions at Endicott Interconnect Technologies, Inc. and IBM Microelectronics. He was a founding member of the IBM Materials Research Community and received an IBM award for “Excellence in Technical Management.” Poliks received his Ph.D. in materials science and engineering from the University of Connecticut and held a McDonnell-Douglas postdoctoral fellowship at Washington University in St. Louis.