Speaker

Nancy Stoffel, Ph.D.

Platform Leader for Flexible Hybrid Electronics
GE Global Research

Dr. Nancy Stoffel, Ph.D. specializes in design and manufacturing of printed electronic systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials, process development and reliability for electronics integration. During her 30+ year industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager working on photonics, microfluidic and MEMS integration. At Xerox she led inkjet device fluidic design, materials technology and reliability and process development for next generation product. Her responsibilities included materials testing and lifetime evaluation for permanent printheads. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.