David is a Technology Manager of the Electronics Packaging Lab at GE Aerospace Research with 22 years of experience. Dave holds technical expertise in materials, component design, system design, harsh environment device development, semiconductor device development, reliability/qualification testing, advanced thermal testing, sub-system testing, and complex system testing. Dave has led efforts in high power distribution, fault management, power conversion, and hybrid electric propulsion systems. David holds a BS in Mechanical Engineering and a MS in Industrial Engineering from the State University of Binghamton. He has 46 U.S. patents and 28 publications in sensors, electronic materials, packaging and power electronics packaging.